EP3C16F256I7 vs EP3C16F256I7N Comparison

Detailed side-by-side comparison of EP3C16F256I7 by Intel and EP3C16F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F256I7 EP3C16F256I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
Logic Elements 15,408 logic elements —
Logic Array Blocks 963 LABs —
User I/O Count 168 I/Os —
Embedded Memory 516,096 bits 56 M9K blocks (504 Kbit)
Maximum Frequency 437.5 MHz —
Core Supply Voltage 1.2 V —
Package 256-LBGA (FBGA) 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Total Terminals 256 terminals —
Operating Temperature -40°C to 125°C -40C to +100C (industrial, I7)
Mounting Type Surface mount —
Lead-Free Status Lead free —
MSL Classification [DATA_NEEDED: MSL classification] —
Programmable Logic FPGA logic array with 15,408 logic elements —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Memory Type [DATA_NEEDED: embedded memory organization and block count] —
PLL Count [DATA_NEEDED: PLL count] —
Differential I/O [DATA_NEEDED: differential I/O capability] —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)
RoHS Compliance — Compliant

Datasheets & Resources

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