EP3C16F256I7N vs EP3C16F256I7 Comparison

Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C16F256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F256I7N EP3C16F256I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 516,096 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Package 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LBGA (FBGA)
Operating Temperature -40C to +100C (industrial, I7) -40°C to 125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Elements — 15,408 logic elements
Logic Array Blocks — 963 LABs
User I/O Count — 168 I/Os
Maximum Frequency — 437.5 MHz
Core Supply Voltage — 1.2 V
Total Terminals — 256 terminals
Mounting Type — Surface mount
Lead-Free Status — Lead free
MSL Classification — [DATA_NEEDED: MSL classification]
Programmable Logic — FPGA logic array with 15,408 logic elements
I/O Standards — [DATA_NEEDED: supported I/O standards]
Memory Type — [DATA_NEEDED: embedded memory organization and block count]
PLL Count — [DATA_NEEDED: PLL count]
Differential I/O — [DATA_NEEDED: differential I/O capability]
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

Datasheets & Resources

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