EP3C16F256I7N vs EP3C16F256I7 对比

详细并排对比 EP3C16F256I7N 出自 Intel 和 EP3C16F256I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C16F256I7N EP3C16F256I7
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 不推荐新设计
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 516,096 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
封装 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LBGA (FBGA)
工作温度 -40C to +100C (industrial, I7) -40°C to 125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Elements — 15,408 logic elements
Logic Array Blocks — 963 LABs
User I/O Count — 168 I/Os
Maximum Frequency — 437.5 MHz
Core Supply Voltage — 1.2 V
Total Terminals — 256 terminals
安装类型 — Surface mount
Lead-Free Status — Lead free
MSL Classification — [DATA_NEEDED: MSL classification]
Programmable Logic — FPGA logic array with 15,408 logic elements
I/O Standards — [DATA_NEEDED: supported I/O standards]
存储器类型 — [DATA_NEEDED: embedded memory organization and block count]
PLL Count — [DATA_NEEDED: PLL count]
Differential I/O — [DATA_NEEDED: differential I/O capability]
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

数据手册与资源

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