EP3C16F256I7N vs EP3C16F256I7 Vergleich

Detaillierter Direktvergleich von EP3C16F256I7N von Intel und EP3C16F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F256I7N EP3C16F256I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 516,096 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Gehäuse 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LBGA (FBGA)
Betriebstemperatur -40C to +100C (industrial, I7) -40°C to 125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Elements — 15,408 logic elements
Logic Array Blocks — 963 LABs
User I/O Count — 168 I/Os
Maximum Frequency — 437.5 MHz
Core Supply Voltage — 1.2 V
Total Terminals — 256 terminals
Montageart — Surface mount
Lead-Free Status — Lead free
MSL Classification — [DATA_NEEDED: MSL classification]
Programmable Logic — FPGA logic array with 15,408 logic elements
I/O Standards — [DATA_NEEDED: supported I/O standards]
Speichertyp — [DATA_NEEDED: embedded memory organization and block count]
PLL Count — [DATA_NEEDED: PLL count]
Differential I/O — [DATA_NEEDED: differential I/O capability]
RoHS-Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

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