EP3C16F484C6N vs EP3C16F484C7N Comparison

Detailed side-by-side comparison of EP3C16F484C6N by Intel and EP3C16F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F484C6N EP3C16F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone III —
Family Cyclone III —
Logic Elements (LE) 15,408 —
Adaptive Logic Modules (ALMs) 963 ALMs —
Embedded Memory 516,096 bits (504 Kbits) 504 Kbits (M9K blocks)
Embedded 18x18 Multipliers 56 —
User I/O Pins (max) 346 —
PLLs 4 4
Global Clock Networks 20 —
Core Supply Voltage 1.15 V to 1.25 V —
Operating Temperature (Commercial) 0 C to 85 C —
Speed Grade -6 -7
Package 484-ball FineLine BGA (FBGA) 484-ball FBGA
Ball Pitch 1.0 mm —
Process Technology 65 nm TSMC 65 nm TSMC low-power
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel —
Mounting Type Surface Mount —
RoHS Status Compliant (lead-free, N suffix) Compliant
Device Family — Cyclone III
Logic Elements — 15,408
Embedded Multipliers — 56 (18x18)
User I/O Pins — 346
Core Voltage — 1.2 V (1.15 V to 1.25 V)
Operating Temperature — 0C to +85C (commercial)
Maximum Internal Frequency — 437.5 MHz
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
Configuration Method — JTAG (IEEE 1149.1), EPCS serial flash, Active Serial

Datasheets & Resources

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