EP3C16F484C6N vs EP3C16F484C7N Comparación
Comparación detallada lado a lado de EP3C16F484C6N por Intel y EP3C16F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484C6N | EP3C16F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $338,75 | $30,10 |
| Series | Cyclone III | — |
| Family | Cyclone III | — |
| Logic Elements (LE) | 15,408 | — |
| Adaptive Logic Modules (ALMs) | 963 ALMs | — |
| Embedded Memory | 516,096 bits (504 Kbits) | 504 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins (max) | 346 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature (Commercial) | 0 C to 85 C | — |
| Speed Grade | -6 | -7 |
| Encapsulado | 484-ball FineLine BGA (FBGA) | 484-ball FBGA |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 65 nm TSMC | 65 nm TSMC low-power |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant (lead-free, N suffix) | Compliant |
| Device Family | — | Cyclone III |
| Logic Elements | — | 15,408 |
| Embedded Multipliers | — | 56 (18x18) |
| User I/O Pins | — | 346 |
| Core Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Maximum Internal Frequency | — | 437.5 MHz |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Configuration Method | — | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial |