EP3C16F484C6N vs EP3C16F484C7N Vergleich
Detaillierter Direktvergleich von EP3C16F484C6N von Intel und EP3C16F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F484C6N | EP3C16F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $338,75 | $30,10 |
| Series | Cyclone III | — |
| Family | Cyclone III | — |
| Logic Elements (LE) | 15,408 | — |
| Adaptive Logic Modules (ALMs) | 963 ALMs | — |
| Embedded Memory | 516,096 bits (504 Kbits) | 504 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | 56 | — |
| User I/O Pins (max) | 346 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature (Commercial) | 0 C to 85 C | — |
| Speed Grade | -6 | -7 |
| Gehäuse | 484-ball FineLine BGA (FBGA) | 484-ball FBGA |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 65 nm TSMC | 65 nm TSMC low-power |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant (lead-free, N suffix) | Compliant |
| Device Family | — | Cyclone III |
| Logic Elements | — | 15,408 |
| Embedded Multipliers | — | 56 (18x18) |
| User I/O Pins | — | 346 |
| Core Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Maximum Internal Frequency | — | 437.5 MHz |
| I/O Standards Supported | — | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Configuration Method | — | JTAG (IEEE 1149.1), EPCS serial flash, Active Serial |