EP3C16U484C6 vs EP3C16F484C6N Comparison

Detailed side-by-side comparison of EP3C16U484C6 by Intel and EP3C16F484C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16U484C6 EP3C16F484C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 15,408 —
Logic Blocks 3,346 —
Embedded Memory 516,096 bits 516,096 bits (504 Kbits)
I/O Count 346 —
Package 484-FBGA 484-ball FineLine BGA (FBGA)
Terminal Count 484 balls —
Mounting Type Surface Mount Surface Mount
Package Shape Rectangular —
Lead Status Lead Free —
Operating Temperature -40°C to +125°C —
Temperature Grade Industrial —
Supply Voltage [DATA_NEEDED: Supply Voltage] —
Maximum Operating Frequency [DATA_NEEDED: Maximum Operating Frequency] —
Embedded RAM Blocks [DATA_NEEDED: Embedded RAM Block Count] —
PLL Count [DATA_NEEDED: PLL Count] —
Block RAM Bit Capacity 516,096 bits —
RoHS Status [DATA_NEEDED: RoHS Status] Compliant (lead-free, N suffix)
Series — Cyclone III
Family — Cyclone III
Logic Elements (LE) — 15,408
Adaptive Logic Modules (ALMs) — 963 ALMs
Embedded 18x18 Multipliers — 56
User I/O Pins (max) — 346
PLLs — 4
Global Clock Networks — 20
Core Supply Voltage — 1.15 V to 1.25 V
Operating Temperature (Commercial) — 0 C to 85 C
Speed Grade — -6
Ball Pitch — 1.0 mm
Process Technology — 65 nm TSMC
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel

Datasheets & Resources

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