EP3C16U484C6 vs EP3C16F484C6N Vergleich

Detaillierter Direktvergleich von EP3C16U484C6 von Intel und EP3C16F484C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16U484C6 EP3C16F484C6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 15,408 —
Logic Blocks 3,346 —
Embedded Memory 516,096 bits 516,096 bits (504 Kbits)
I/O Count 346 —
Gehäuse 484-FBGA 484-ball FineLine BGA (FBGA)
Terminal Count 484 balls —
Montageart Surface Mount Surface Mount
Package Shape Rectangular —
Lead Status Lead Free —
Betriebstemperatur -40°C to +125°C —
Temperature Grade Industrial —
Versorgungsspannung [DATA_NEEDED: Supply Voltage] —
Maximum Operating Frequency [DATA_NEEDED: Maximum Operating Frequency] —
Embedded RAM Blocks [DATA_NEEDED: Embedded RAM Block Count] —
PLL Count [DATA_NEEDED: PLL Count] —
Block RAM Bit Capacity 516,096 bits —
RoHS-Status [DATA_NEEDED: RoHS Status] Compliant (lead-free, N suffix)
Series — Cyclone III
Family — Cyclone III
Logic Elements (LE) — 15,408
Adaptive Logic Modules (ALMs) — 963 ALMs
Embedded 18x18 Multipliers — 56
User I/O Pins (max) — 346
PLLs — 4
Global Clock Networks — 20
Core Supply Voltage — 1.15 V to 1.25 V
Operating Temperature (Commercial) — 0 C to 85 C
Speed Grade — -6
Ball Pitch — 1.0 mm
Process Technology — 65 nm TSMC
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel

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