EP3C25F324C6N vs EP3C25F324C7 Comparison

Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C6N EP3C25F324C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) —
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
Package 324-BGA (FBGA-324), fine-pitch —
Speed Grade C6 (commercial) —
Operating Temperature 0C to +85C (commercial) —
Process Technology TSMC 65 nm low-power (LP) —
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
Mounting Type Surface Mount Surface Mount
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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