EP3C25F324C6N vs EP3C25F324C7 对比
详细并排对比 EP3C25F324C6N 出自 Intel 和 EP3C25F324C7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C25F324C6N | EP3C25F324C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Series | Cyclone III | — |
| Family | Cyclone III (low-power, low-cost FPGA) | — |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | — |
| 封装 | 324-BGA (FBGA-324), fine-pitch | — |
| Speed Grade | C6 (commercial) | — |
| 工作温度 | 0C to +85C (commercial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Memory Bits | — | 608,256 bits |
| Number of I/O | — | 215 |
| Package Type | — | 324-BGA |
| Package Code | — | BGA |
| Number of Terminals | — | 324 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| 工作温度范围 | — | [DATA_NEEDED: operating temperature range] |
| Internal Memory Configuration | — | [DATA_NEEDED: internal memory configuration] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |