EP3C25F324C6N vs EP3C25F324C7 Comparação

Comparação detalhada lado a lado de EP3C25F324C6N por Intel e EP3C25F324C7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP3C25F324C6N EP3C25F324C7
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) —
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
Encapsulamento 324-BGA (FBGA-324), fine-pitch —
Speed Grade C6 (commercial) —
Temperatura de operação 0C to +85C (commercial) —
Process Technology TSMC 65 nm low-power (LP) —
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
Tipo de montagem Surface Mount Surface Mount
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Fichas técnicas e recursos

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