EP3C25F324C6N vs EP3C25F324C7 Perbandingan

Perbandingan bersamaan detil EP3C25F324C6N dari Intel dan EP3C25F324C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3C25F324C6N EP3C25F324C7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone III —
Family Cyclone III (low-power, low-cost FPGA) —
Logic Elements (LE) 24,624 —
Total Memory Bits 608,256 bits —
Embedded Memory Blocks M9K blocks, 66 total —
Embedded Multipliers 66 (18x18) —
DSP Blocks 66 dedicated 18x18 multipliers —
User I/O Pins 215 —
Number of I/O Banks 8 —
PLLs 4 general-purpose PLLs —
Paket 324-BGA (FBGA-324), fine-pitch —
Speed Grade C6 (commercial) —
Suhu Kerja 0C to +85C (commercial) —
Process Technology TSMC 65 nm low-power (LP) —
Configuration Schemes Passive Serial, Fast Passive Parallel, JTAG —
Lead-Free / RoHS Yes (lead-free, RoHS compliant) —
Tipe Mounting Surface Mount Surface Mount
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Rentang Suhu Kerja — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

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