EP3C40F780C7N vs EP3C40F780C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F780C7N disebabkan oleh Intel dan EP3C40F780C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F780C7N | EP3C40F780C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | — |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Speed Grade | 7 (C7, commercial) | 8 (C8) |
| Process Node | 65 nm TSMC low-power | — |
| Suhu Operasi | 0C to +85C (commercial) | 0°C to +85°C (Commercial) |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Series | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Embedded 18x18 Multipliers | — | 126 (up to 396 9x9) |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Process Technology | — | 65nm TSMC low-power |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Status RoHS | — | Compliant |