EP3C55F780C7 vs EP3C55F780C8N Comparison
Detailed side-by-side comparison of EP3C55F780C7 by Intel and EP3C55F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F780C7 | EP3C55F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $76.75 | $58.20 |
| Family | Cyclone III | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | β |
| Embedded 18x18 Multipliers | 234 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | β |
| Package | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | β |
| Maximum Internal Clock Frequency | 437.5 MHz | β |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm TSMC low-power |
| Operating Temperature Grade | Commercial (C) | β |
| Speed Grade | 7 | 8 (commercial, slowest) |
| Configuration Modes | AS, PS, JTAG, FPP | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Mounting Type | Surface Mount (BGA) | β |
| RoHS Status | Compliant | Compliant (lead-free FBGA) |
| Series | β | Cyclone III |
| Logic Array Blocks (LAB) | β | 3,491 |
| Total RAM Bits | β | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | β | 260 |
| Maximum User I/O | β | 377 |
| User I/O Banks | β | 4 |
| Core Supply Voltage | β | 1.15 V to 1.25 V |
| Operating Temperature | β | 0C to +85C (commercial, 'C' suffix) |
| Internal Frequency (typ.) | β | 402 MHz |