EP3C55F780C7 vs EP3C55F780C8N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7 von Intel und EP3C55F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7 | EP3C55F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $76,75 | $58,20 |
| Family | Cyclone III | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Gehäuse | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm TSMC low-power |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | 8 (commercial, slowest) |
| Configuration Modes | AS, PS, JTAG, FPP | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Series | — | Cyclone III |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Maximum User I/O | — | 377 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Betriebstemperatur | — | 0C to +85C (commercial, 'C' suffix) |
| Internal Frequency (typ.) | — | 402 MHz |