EP3C55F780C7 vs EP3C55F780C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C7 sa pamamagitan ng Intel at EP3C55F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C7 | EP3C55F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Packhaging | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm TSMC low-power |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | 8 (commercial, slowest) |
| Configuration Modes | AS, PS, JTAG, FPP | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Series | — | Cyclone III |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Maximum User I/O | — | 377 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Temperature na Operasyon | — | 0C to +85C (commercial, 'C' suffix) |
| Internal Frequency (typ.) | — | 402 MHz |