EP3C55F780C7 vs EP3C55F780C8N Comparación
Comparación detallada lado a lado de EP3C55F780C7 por Intel y EP3C55F780C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C7 | EP3C55F780C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $76,75 | $58,20 |
| Family | Cyclone III | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Encapsulado | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm TSMC low-power |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | 8 (commercial, slowest) |
| Configuration Modes | AS, PS, JTAG, FPP | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Series | — | Cyclone III |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| Maximum User I/O | — | 377 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, 'C' suffix) |
| Internal Frequency (typ.) | — | 402 MHz |