EP3C5M164I7N vs EP3C5M164C7N Comparison

Detailed side-by-side comparison of EP3C5M164I7N by Intel and EP3C5M164C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5M164I7N EP3C5M164C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Logic Elements (LE) 5136 —
Embedded Memory 423936 bits (approx. 414 Kbit) M9K blocks (RAM)
Embedded Multipliers 23 x 18x18 —
User I/O Pins 106 106 (max)
Package 164-TFBGA (Micro BGA, M164, 8x8 mm) 164-ball MBGA (8x8 mm, 0.5 mm pitch)
Core Voltage (VCCINT) 1.2 V —
Speed Grade 7 7
Temperature Grade Industrial (-40C to +100C junction) —
Process Technology 60 nm TSMC low-k 65 nm TSMC low-power
PLLs 2 4
Mounting Type Surface Mount Surface Mount
Ball Pitch 0.5 mm —
Configuration Modes PS, FPP, AS —
External Memory Support DDR, DDR2, SDR, QDRII+ SRAM —
I/O Standards LVDS, SSTL, HSTL, LVCMOS —
RoHS Status Compliant Compliant
MSL Level [DATA_NEEDED: MSL level] 3
Operating Junction Temperature -40C to +100C —
Family — Cyclone III
Device Logic Elements — 5,136
Total Memory Bits — 423,936 bits
Embedded Multipliers (18x18) — 23
Operating Temperature — 0C to +85C (commercial)
Configuration Mode — JTAG / Active Serial (AS) / Passive Serial (PS)

Datasheets & Resources

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