EP3C5M164I7N vs EP3C5M164C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5M164I7N sa pamamagitan ng Intel at EP3C5M164C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5M164I7N | EP3C5M164C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Elements (LE) | 5136 | — |
| Embedded Memory | 423936 bits (approx. 414 Kbit) | M9K blocks (RAM) |
| Embedded Multipliers | 23 x 18x18 | — |
| User I/O Pins | 106 | 106 (max) |
| Packhaging | 164-TFBGA (Micro BGA, M164, 8x8 mm) | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | 7 | 7 |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Process Technology | 60 nm TSMC low-k | 65 nm TSMC low-power |
| PLLs | 2 | 4 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Ball Pitch | 0.5 mm | — |
| Configuration Modes | PS, FPP, AS | — |
| External Memory Support | DDR, DDR2, SDR, QDRII+ SRAM | — |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 |
| Temperature ng Junction na Operasyon | -40C to +100C | — |
| Family | — | Cyclone III |
| Device Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 23 |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Mode | — | JTAG / Active Serial (AS) / Passive Serial (PS) |