EP3C5M164I7N vs EP3C5M164C7N Vergleich
Detaillierter Direktvergleich von EP3C5M164I7N von Intel und EP3C5M164C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5M164I7N | EP3C5M164C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,40 | $17,20 |
| Logic Elements (LE) | 5136 | — |
| Embedded Memory | 423936 bits (approx. 414 Kbit) | M9K blocks (RAM) |
| Embedded Multipliers | 23 x 18x18 | — |
| User I/O Pins | 106 | 106 (max) |
| Gehäuse | 164-TFBGA (Micro BGA, M164, 8x8 mm) | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | 7 | 7 |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Process Technology | 60 nm TSMC low-k | 65 nm TSMC low-power |
| PLLs | 2 | 4 |
| Montageart | Surface Mount | Surface Mount |
| Ball Pitch | 0.5 mm | — |
| Configuration Modes | PS, FPP, AS | — |
| External Memory Support | DDR, DDR2, SDR, QDRII+ SRAM | — |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: MSL level] | 3 |
| Betriebs-Sperrschichttemperatur | -40C to +100C | — |
| Family | — | Cyclone III |
| Device Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 bits |
| Embedded Multipliers (18x18) | — | 23 |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Configuration Mode | — | JTAG / Active Serial (AS) / Passive Serial (PS) |