EP3C5U256A7N vs EP3C5F256C8N Comparison

Detailed side-by-side comparison of EP3C5U256A7N by Intel and EP3C5F256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5U256A7N EP3C5F256C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone III Cyclone III
Logic Elements 5,136 LE —
Embedded Memory 414 kbit (423,936 bits) —
Number of I/Os 182 —
Operating Supply Voltage (Core) 1.15 V to 1.25 V —
Mounting Style SMD/SMT —
Package / Case BGA-256 (U256 Ultra FineLine) —
Packaging Tray —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +125 C (Automotive grade) —
Temperature Grade Automotive —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] —
Number of PLLs 4 —
Process Node 60 nm low-power CMOS —
Speed Grade -7 —
RoHS Status Compliant Lead Free (per Altera/Intel product page)
Device Family — Cyclone III (EP3C5)
Logic Elements (LEs) — 5,136
Embedded Memory (bits) — 423,936
Embedded Memory (Kbits) — 414 Kbits
Embedded 18x18 Multipliers — 23
PLLs — 4
Maximum User I/Os — 182
Core Voltage — 1.15 V to 1.25 V
Operating Temperature — 0C to 85C (Commercial)
Package — 256-ball FBGA (FineLine BGA)
Process Technology — 65 nm
Configuration Memory — SRAM-based (in-system reprogrammable)
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Mounting Type — Surface Mount

Datasheets & Resources

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