EP3C5U256A7N vs EP3C5F256I7N Comparison

Detailed side-by-side comparison of EP3C5U256A7N by Intel and EP3C5F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5U256A7N EP3C5F256I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $16.20 $24.00
Series Cyclone III β€”
Logic Elements 5,136 LE 5,136
Embedded Memory 414 kbit (423,936 bits) β€”
Number of I/Os 182 β€”
Operating Supply Voltage (Core) 1.15 V to 1.25 V β€”
Mounting Style SMD/SMT β€”
Package / Case BGA-256 (U256 Ultra FineLine) β€”
Packaging Tray β€”
Minimum Operating Temperature -40 C β€”
Maximum Operating Temperature +125 C (Automotive grade) β€”
Temperature Grade Automotive β€”
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] β€”
Embedded Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] 26
Number of PLLs 4 β€”
Process Node 60 nm low-power CMOS β€”
Speed Grade -7 β€”
RoHS Status Compliant Compliant
Family β€” Cyclone III
Total Memory Bits β€” 423,936 bits
PLLs β€” 2
Maximum User I/Os β€” 182
Package β€” 256-FBGA (FineLine BGA)
Operating Temperature β€” -40C to +125C (Industrial)
Supply Voltage - Core β€” 1.15 V to 1.25 V (typical 1.2 V)
Process Technology β€” TSMC 65nm low-power
Configuration Modes β€” Active Serial, Passive Serial, JTAG, FPP
I/O Standards β€” LVTTL, LVCMOS, LVDS, SSTL, HSTL
MSL Level β€” 3 (168 hours)
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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