EP3C5U256A7N vs EP3C5F256I7N Comparación
Comparación detallada lado a lado de EP3C5U256A7N por Intel y EP3C5F256I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5U256A7N | EP3C5F256I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,20 | $24,00 |
| Series | Cyclone III | — |
| Logic Elements | 5,136 LE | 5,136 |
| Embedded Memory | 414 kbit (423,936 bits) | — |
| Number of I/Os | 182 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Estilo de montaje | SMD/SMT | — |
| Encapsulado / Carcasa | BGA-256 (U256 Ultra FineLine) | — |
| Packaging | Tray | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive grade) | — |
| Temperature Grade | Automotive | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | 26 |
| Number of PLLs | 4 | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | -7 | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone III |
| Total Memory Bits | — | 423,936 bits |
| PLLs | — | 2 |
| Maximum User I/Os | — | 182 |
| Encapsulado | — | 256-FBGA (FineLine BGA) |
| Temperatura de funcionamiento | — | -40C to +125C (Industrial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Process Technology | — | TSMC 65nm low-power |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Nivel MSL | — | 3 (168 hours) |
| Tipo de montaje | — | Surface Mount (BGA) |