EP3SE110F1152C3N vs EP3SE110F1152C4 Comparison
Detailed side-by-side comparison of EP3SE110F1152C3N by Intel and EP3SE110F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N β Last Time BuyIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 β Last Time BuySpecification Comparison
| Parameter | EP3SE110F1152C3N | EP3SE110F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,560.00 | $2,200.00 |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | β |
| Logic Elements (LE) | 107,500 | β |
| Logic Array Blocks (LABs) | 4,300 | [DATA_NEEDED: LAB count] |
| Total RAM Bits | 8,936,448 | β |
| User I/Os | 744 | β |
| Operating Frequency (max) | 500 MHz | β |
| Core Supply Voltage | 1.1 V nominal | β |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply range] | β |
| Process Technology | 65 nm TSMC | 65 nm |
| Package Type | FC-FBGA-1152 (flip-chip BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | β |
| Speed Grade | C3 | β |
| Mounting Type | Surface Mount | β |
| Mounting Style | SMD/SMT (Tray) | β |
| DSP Blocks | Yes (embedded multipliers) | [DATA_NEEDED: 18x18 multiplier count] |
| Memory Type | M9K and M144K block RAM | β |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling | β |
| Boundary Scan | IEEE 1149.1 (JTAG) | β |
| RoHS | [DATA_NEEDED: RoHS status] | β |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) | β |
| Logic Elements | β | 107,500 |
| Embedded Memory | β | 8,936,448 bits |
| Maximum User I/Os | β | 744 |
| Core Voltage | β | 1.1 V |
| Maximum Performance | β | 450 MHz |
| Operating Temperature Grade | β | Commercial (C4) |
| Configuration Memory | β | SRAM-based (volatile) |
| On-chip Termination | β | Dynamic, programmable |
| I/O Standards Supported | β | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| RoHS Status | β | Compliant |