EP3SE110F780C4N vs EP3SE110F780C3N Comparison
Detailed side-by-side comparison of EP3SE110F780C4N by Intel and EP3SE110F780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE110F780C4N | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,395.00 | $1,245.00 |
| Series | Stratix III E | β |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | 107,500 |
| Embedded Memory Bits | 8936448 | 8,936,448 |
| User I/O Count | 488 | β |
| Number of Terminals | 780 | β |
| Package Type | 780-BBGA, FCBGA | β |
| Package Code | BGA | β |
| Terminal Form | Ball | β |
| Package Shape | Square | β |
| Speed Grade | C4 | β |
| Operating Temperature | 0C to 85C (Commercial) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Process Node | 65 nm | β |
| Configuration Mode | PS / FPP / JTAG | β |
| Logic Array Blocks (LABs) | β | 4,300 |
| User I/Os | β | 488 |
| Package | β | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | β | 1.1 V |
| Process Technology | β | 65 nm |
| Maximum Operating Frequency | β | 500 MHz |
| DSP Blocks | β | Yes (integrated, count varies by configuration) |
| Transceiver Channels | β | 8 (multi-gigabit) |
| Embedded Memory | β | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | β | Serial / Parallel via Quartus II |
| Operating Temperature Grade | β | Commercial (C suffix) |
| MSL Level | β | [DATA_NEEDED: MSL rating] |