EP3SE110F780C4N vs EP3SE110F780C3N 对比
详细并排对比 EP3SE110F780C4N 出自 Intel 和 EP3SE110F780C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE110F780C4N | EP3SE110F780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $1,245.00 |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | 107,500 |
| Embedded Memory Bits | 8936448 | 8,936,448 |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | — |
| 工作温度 | 0C to 85C (Commercial) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| 封装 | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |