EP3SE260F1152C4LN vs EP3SE110F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C4LN by Intel and EP3SE110F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152C4LN EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN ⚠ Last Time Buy
Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152C4LN EP3SE110F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,400.00 $1,395.00
Family Stratix III E Stratix III Enhanced (E)
Logic Elements (LE) 255,000 β€”
Embedded Memory 16,672,768 bits β€”
Logic Array Blocks (LABs) 10,200 4300
User I/Os 744 β€”
Package 1152-ball FC-BGA 1152-ball FCBGA (Flip-Chip BGA)
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 1.1 V
Core Clock Speed 375 MHz (max) β€”
Transceiver Data Rate 717 MHz β€”
Speed Grade C4 β€”
Operating Temperature 0C to +85C (commercial) 0C to +85C (Commercial)
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL level] 3 (168 hours)
RoHS Status Compliant Compliant
Logic Elements β€” 107,500
Memory Bits β€” 8,936,448
Embedded Multipliers (18x18) β€” 896
User I/O Pins β€” 744
Maximum Operating Frequency β€” 450 MHz
Configuration Method β€” Passive Serial / Fast Passive Parallel / JTAG / AES-256
Design Software β€” Quartus II (v9.1 or later)

Datasheets & Resources

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