EP3SE260F1152C4LN vs EP3SE110F1152C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4LN disebabkan oleh Intel dan EP3SE110F1152C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN ⚠ Bahagian terakhir untuk beliIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152C4LN | EP3SE110F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 4300 |
| User I/Os | 744 | — |
| Kemasan | 1152-ball FC-BGA | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Core Clock Speed | 375 MHz (max) | — |
| Transceiver Data Rate | 717 MHz | — |
| Speed Grade | C4 | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 107,500 |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Maximum Operating Frequency | — | 450 MHz |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Design Software | — | Quartus II (v9.1 or later) |