EP3SE260F1152I4N vs EP3SE260F1152I3N Comparison

Detailed side-by-side comparison of EP3SE260F1152I4N by Intel and EP3SE260F1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152I4N EP3SE260F1152I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Series Stratix III E Stratix III E
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 10200
Maximum User I/O 744 —
DSP Blocks (18x18 multipliers) 896 —
Transceivers 48 (up to 8.5 Gbps) —
Core Voltage 0.86 V 0.9 V to 1.1 V selectable
Process Technology TSMC 40 nm 65 nm CMOS
Package 1152-ball FCBGA (35 mm x 35 mm) —
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +100C (Industrial) -40C to +100C (industrial)
Speed Grade 4 —
MSL Level 3 (168 hours) [DATA_NEEDED: MSL level]
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Family Name — Stratix III E
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of I/Os — 744
Number of Gates — [DATA_NEEDED: number of gates]
Package / Case — 1152-BBGA, FCBGA (FC-FBGA)
Max Internal Frequency — 500 MHz
Supplier Temperature Grade — Industrial

Datasheets & Resources

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