EP3SE260F1152I4N vs EP3SE260F1152I3N 对比

详细并排对比 EP3SE260F1152I4N 出自 Intel 和 EP3SE260F1152I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ 最后一次采购
Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1152I4N EP3SE260F1152I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $2,050.00 $3,360.00
Series Stratix III E Stratix III E
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 10200
Maximum User I/O 744 —
DSP Blocks (18x18 multipliers) 896 —
Transceivers 48 (up to 8.5 Gbps) —
Core Voltage 0.86 V 0.9 V to 1.1 V selectable
Process Technology TSMC 40 nm 65 nm CMOS
封装 1152-ball FCBGA (35 mm x 35 mm) —
安装类型 Surface Mount Surface Mount
工作温度 -40C to +100C (Industrial) -40C to +100C (industrial)
Speed Grade 4 —
MSL 等级 3 (168 hours) [DATA_NEEDED: MSL level]
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Family Name — Stratix III E
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of I/Os — 744
Number of Gates — [DATA_NEEDED: number of gates]
封装 / 外壳 — 1152-BBGA, FCBGA (FC-FBGA)
Max Internal Frequency — 500 MHz
Supplier Temperature Grade — Industrial

数据手册与资源

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