EP3SE50F484C2N vs EP3SE50F484C2G Comparison
Detailed side-by-side comparison of EP3SE50F484C2N by Intel and EP3SE50F484C2G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE50F484C2N | EP3SE50F484C2G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5,934.83 | $1,180.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III E FPGA | β |
| Logic Elements | 47,500 | β |
| Embedded Memory | 2,304 Kbits | β |
| DSP Blocks (18x18) | 264 | β |
| User I/Os | 296 | β |
| LABs/CLBs | 1,900 | β |
| Core Voltage | 0.9 V / 1.1 V | β |
| Internal Frequency | 600 MHz | β |
| Process Technology | 65 nm | 40 nm TSMC low-power CMOS |
| Package | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) | β |
| Operating Temperature | 0C to +85C (Commercial) | 0 Β°C to +85 Β°C (TJ) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| Number of Logic Elements / Cells | β | 47,500 |
| Number of LABs / CLBs | β | 1,900 |
| Total RAM Bits | β | 5,760,000 (5,760 Kbit) |
| Number of User I/O | β | 296 |
| Package / Case | β | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | β | 0.86 V to 1.15 V |
| Logic Element Architecture | β | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | β | Yes (variable-precision multipliers) |
| Transceivers | β | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | β | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | β | Supported |
| Configuration Interface | β | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | β | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |