EP3SE50F484C2N vs EP3SE50F484C2G Comparação
Comparação detalhada lado a lado de EP3SE50F484C2N por Intel e EP3SE50F484C2G por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3SE50F484C2N | EP3SE50F484C2G |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5.934,83 | $1.180,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III E FPGA | — |
| Logic Elements | 47,500 | — |
| Embedded Memory | 2,304 Kbits | — |
| DSP Blocks (18x18) | 264 | — |
| User I/Os | 296 | — |
| LABs/CLBs | 1,900 | — |
| Core Voltage | 0.9 V / 1.1 V | — |
| Internal Frequency | 600 MHz | — |
| Process Technology | 65 nm | 40 nm TSMC low-power CMOS |
| Encapsulamento | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) | — |
| Temperatura de operação | 0C to +85C (Commercial) | 0 °C to +85 °C (TJ) |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| Encapsulamento / Caixa | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |