EP3SE50F484C2N vs EP3SE50F484C2G 对比
详细并排对比 EP3SE50F484C2N 出自 Intel 和 EP3SE50F484C2G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F484C2N | EP3SE50F484C2G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,934.83 | $1,180.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III E FPGA | — |
| Logic Elements | 47,500 | — |
| Embedded Memory | 2,304 Kbits | — |
| DSP Blocks (18x18) | 264 | — |
| User I/Os | 296 | — |
| LABs/CLBs | 1,900 | — |
| Core Voltage | 0.9 V / 1.1 V | — |
| Internal Frequency | 600 MHz | — |
| Process Technology | 65 nm | 40 nm TSMC low-power CMOS |
| 封装 | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) | — |
| 工作温度 | 0C to +85C (Commercial) | 0 °C to +85 °C (TJ) |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| 封装 / 外壳 | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |