EP3SE50F484C4LG vs EP3SE50F484C4L Comparison

Detailed side-by-side comparison of EP3SE50F484C4LG by Intel and EP3SE50F484C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F484C4LG EP3SE50F484C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Family Stratix® III E Stratix III E
Logic Elements 47,500 LE 47,500
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 5.49 Mbit (2,886 Kbit M9K + M144K blocks) 5,760 Kbits (M9K + M144K + MLAB)
Maximum User I/O 296 —
Hardware Multipliers (18x18) 384 —
PLLs 4 12
Operating Supply Voltage (Core) 1.1 V —
Operating Temperature Range 0°C to +85°C (Commercial) —
Speed Grade -4 -4 (performance-oriented)
Package 484-Ball FCBGA, 23 x 23 mm 484-ball FC-FBGA
Mounting Type Surface Mount Surface Mount (BGA)
Process Node 40 nm TSMC —
Lead-Free / RoHS Yes (lead-free finish, RoHS compliant) —
MSL Level 3 (per JEDEC J-STD-020) 3 (168 hours)
Design Software Quartus II 11.0 or later —
Logic Array Blocks (LABs) — 1,900
Embedded Multipliers (18x18) — 384
Maximum User I/Os — 296
Process Technology — 65 nm CMOS
Temperature Grade — Commercial (0 C to +85 C)
Core Voltage (typical) — 0.9 V
Lead-Free Finish — Yes (L suffix)

Datasheets & Resources

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