EP3SE50F780C2N vs EP3SE50F780C4N Comparison

Detailed side-by-side comparison of EP3SE50F780C2N by Intel and EP3SE50F780C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C2N EP3SE50F780C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $278.90 $1,430.00
Family Stratix III Enhanced (E) Stratix III E
Logic Elements 47,500 β€”
Adaptive Logic Modules (ALMs) 19,000 β€”
Embedded Memory 5,760,000 bits β€”
DSP Blocks Yes (number not in source data) β€”
User I/O Count 488 β€”
Transceiver Channels 12 (data rate not in source data) Up to 12 (per family, model-dependent)
Process Technology 65 nm CMOS β€”
Core Voltage 0.9 V to 1.1 V β€”
Maximum Internal Clock Frequency 600 MHz β€”
Package 780-ball FC-FBGA (FBGA-780) 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Speed Grade C2 β€”
Temperature Grade Commercial (C2) β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Lead Free Yes β€”
Configuration Mode Passive Serial / Fast Passive Parallel β€”
Logic Elements (LE) β€” 47,500
Embedded Memory Bits β€” 5,760,000
Embedded Memory (M9K/M144K blocks) β€” 488 (per family datasheet)
Number of LABs β€” 1900
Maximum User I/Os β€” 488
DSP Blocks (18x18 multipliers) β€” 432
PLLs β€” 12 (per family datasheet)
Maximum Operating Frequency β€” 717 MHz
Transceiver Data Rate β€” Up to 6.375 Gbps (per Stratix III E family)
Process Node β€” 40 nm
Supply Voltage β€” Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Operating Temperature β€” 0C to +85C (C4 commercial grade)
Configuration Modes β€” JTAG, Passive Serial, Fast Passive Parallel
RoHS Status β€” Lead-free / RoHS compliant
MSL Level β€” 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller β€” DDR2/DDR3 SDRAM (per Stratix III E family)

Datasheets & Resources

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