EP3SE50F780C2N vs EP3SE50F780C4N 비교
다음의 상세 나란히 비교: EP3SE50F780C2N 제조: Intel 및 EP3SE50F780C4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE50F780C2N | EP3SE50F780C4N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $278.90 | $1,430.00 |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | — |
| Transceiver Channels | 12 (data rate not in source data) | Up to 12 (per family, model-dependent) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V to 1.1 V | — |
| Maximum Internal Clock Frequency | 600 MHz | — |
| 패키지 | 780-ball FC-FBGA (FBGA-780) | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| Speed Grade | C2 | — |
| Temperature Grade | Commercial (C2) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory Bits | — | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | — | 488 (per family datasheet) |
| Number of LABs | — | 1900 |
| Maximum User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 432 |
| PLLs | — | 12 (per family datasheet) |
| Maximum Operating Frequency | — | 717 MHz |
| Transceiver Data Rate | — | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | — | 40 nm |
| 공급 전압 | — | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| 동작 온도 | — | 0C to +85C (C4 commercial grade) |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS 상태 | — | Lead-free / RoHS compliant |
| MSL 레벨 | — | 3 (per JEDEC J-STD-020, FBGA package) |
| Hard Memory Controller | — | DDR2/DDR3 SDRAM (per Stratix III E family) |