EP3SE50F780C2N vs EP3SE50F780C4N Vergleich

Detaillierter Direktvergleich von EP3SE50F780C2N von Intel und EP3SE50F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F780C2N EP3SE50F780C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $278,90 $1.430,00
Family Stratix III Enhanced (E) Stratix III E
Logic Elements 47,500 —
Adaptive Logic Modules (ALMs) 19,000 —
Embedded Memory 5,760,000 bits —
DSP Blocks Yes (number not in source data) —
User I/O Count 488 —
Transceiver Channels 12 (data rate not in source data) Up to 12 (per family, model-dependent)
Process Technology 65 nm CMOS —
Core Voltage 0.9 V to 1.1 V —
Maximum Internal Clock Frequency 600 MHz —
Gehäuse 780-ball FC-FBGA (FBGA-780) 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Speed Grade C2 —
Temperature Grade Commercial (C2) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Lead Free Yes —
Configuration Mode Passive Serial / Fast Passive Parallel —
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Versorgungsspannung — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Betriebstemperatur — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
RoHS-Status — Lead-free / RoHS compliant
MSL-Level — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

Datenblätter & Ressourcen

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