EP3SL200H780C4L vs EP3SE260H780C4L Comparison
Detailed side-by-side comparison of EP3SL200H780C4L by Intel and EP3SE260H780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780C4L | EP3SE260H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6,459.35 | $1,190.00 |
| Manufacturer | Intel (formerly Altera) | β |
| Series | Stratix III | β |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory | 6.5 Mbit | β |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | β |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | β |
| Package Mounting | Surface Mount | β |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | β |
| Speed Grade | -4 (medium performance, commercial) | C4 (middle/slow tier) |
| Operating Temperature | 0C to 85C (commercial) | β |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | β |
| RoHS Status | Compliant | Compliant (lead-free per datasheet) |
| Process Technology | TSMC 40 nm | β |
| Configuration Modes | FPP, AS, PS, JTAG | β |
| Family | β | Stratix III E |
| LABs/CLBs | β | 10,200 |
| Total RAM Bits | β | 16,672,768 (16.7 Mbit) |
| Package | β | 780-ball FCBGA (HBGA 33x33 mm) |
| Core Voltage | β | 0.9 V (nominal) |
| Operating Junction Temperature | β | 0C to +85C (commercial) |
| Mounting Type | β | Surface Mount (flip-chip BGA) |
| MSL Level | β | [DATA_NEEDED: MSL level] |
| Transceivers | β | Up to 24 multi-gigabit transceivers |
| Memory Interface | β | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | β | PS, FPP, JTAG with EPCS/EPCQ |