EP3SL200H780C4L vs EP3SE260H780C4L 对比
详细并排对比 EP3SL200H780C4L 出自 Intel 和 EP3SE260H780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL200H780C4L | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6,459.35 | $1,190.00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | C4 (middle/slow tier) |
| 工作温度 | 0C to 85C (commercial) | — |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| RoHS 状态 | Compliant | Compliant (lead-free per datasheet) |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| 封装 | — | 780-ball FCBGA (HBGA 33x33 mm) |
| Core Voltage | — | 0.9 V (nominal) |
| 工作结温 | — | 0C to +85C (commercial) |
| 安装类型 | — | Surface Mount (flip-chip BGA) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |