EP3SL200H780C4L vs EP3SE260H780C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C4L disebabkan oleh Intel dan EP3SE260H780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C4L | EP3SE260H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | C4 (middle/slow tier) |
| Suhu Operasi | 0C to 85C (commercial) | — |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Status RoHS | Compliant | Compliant (lead-free per datasheet) |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| Kemasan | — | 780-ball FCBGA (HBGA 33x33 mm) |
| Core Voltage | — | 0.9 V (nominal) |
| Suhu Hubungan Operasi | — | 0C to +85C (commercial) |
| Jenis Pemasangan | — | Surface Mount (flip-chip BGA) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |