EP3SL200H780C4L vs EP3SE260H780C4L Comparación
Comparación detallada lado a lado de EP3SL200H780C4L por Intel y EP3SE260H780C4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780C4L | EP3SE260H780C4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.459,35 | $1.190,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | C4 (middle/slow tier) |
| Temperatura de funcionamiento | 0C to 85C (commercial) | — |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Estado RoHS | Compliant | Compliant (lead-free per datasheet) |
| Process Technology | TSMC 40 nm | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| Encapsulado | — | 780-ball FCBGA (HBGA 33x33 mm) |
| Core Voltage | — | 0.9 V (nominal) |
| Temperatura de unión de funcionamiento | — | 0C to +85C (commercial) |
| Tipo de montaje | — | Surface Mount (flip-chip BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |