EP3SL70F780C2G vs EP3SL70F780C4L Comparison

Detailed side-by-side comparison of EP3SL70F780C2G by Intel and EP3SL70F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL70F780C2G EP3SL70F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,185.00 $944.74
Family Stratix III L β€”
Logic Elements 67,500 β€”
Embedded Memory 2,699,264 bits β€”
User I/O Count 488 β€”
Package 780-ball FCBGA (FineLine BGA) β€”
Speed Grade C2 (medium) C4
Temperature Grade Commercial (0 C to 85 C) β€”
Process Node 40 nm low-power CMOS β€”
Core Voltage (VCC) 0.9 V 0.9 V
DSP Blocks Yes (dedicated) β€”
Memory Interfaces Supported DDR3, DDR2, QDR II+, RLDRAM II β€”
PCIe Hard IP Gen1/Gen2 β€”
Transceivers [DATA_NEEDED: transceiver count and data rate] β€”
PLLs Fractional PLLs β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status Compliant β€”
Manufacturer β€” Intel (formerly Altera)
Series β€” Stratix III L
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements (LE) β€” 67,500
Total Memory Bits β€” 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) β€” 2,700
Maximum User I/O β€” 488
Process Technology β€” 65 nm
Internal Frequency (max) β€” [DATA_NEEDED: internal frequency]
Operating Temperature β€” 0C to 85C (commercial)
Package Type β€” 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS β€” Yes (lead-free per BGA package)
Configuration Method β€” JTAG, Passive Serial, FPP, external memory
Design Software β€” Quartus II (Stratix III device support)

Datasheets & Resources

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