EP3SL70F780C2G vs EP3SL70F780C4L Vergleich

Detaillierter Direktvergleich von EP3SL70F780C2G von Intel und EP3SL70F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL70F780C2G EP3SL70F780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.185,00 $944,74
Family Stratix III L —
Logic Elements 67,500 —
Embedded Memory 2,699,264 bits —
User I/O Count 488 —
Gehäuse 780-ball FCBGA (FineLine BGA) —
Speed Grade C2 (medium) C4
Temperature Grade Commercial (0 C to 85 C) —
Process Node 40 nm low-power CMOS —
Core Voltage (VCC) 0.9 V 0.9 V
DSP Blocks Yes (dedicated) —
Memory Interfaces Supported DDR3, DDR2, QDR II+, RLDRAM II —
PCIe Hard IP Gen1/Gen2 —
Transceivers [DATA_NEEDED: transceiver count and data rate] —
PLLs Fractional PLLs —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant —
Manufacturer — Intel (formerly Altera)
Series — Stratix III L
Device Type — FPGA - Field Programmable Gate Array
Logic Elements (LE) — 67,500
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Logic Array Blocks (LABs) — 2,700
Maximum User I/O — 488
Process Technology — 65 nm
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Betriebstemperatur — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory
Design Software — Quartus II (Stratix III device support)

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