EP4CE55F23C7N vs EP4CE55F23C9L Comparison
Detailed side-by-side comparison of EP4CE55F23C7N by Intel and EP4CE55F23C9L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23C7N | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Maximum User I/O | 324 | — |
| Embedded 18x18 Multipliers | 66 | 156 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 472.5 MHz (C7 speed grade) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | — |
| Package | 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (F23) |
| Operating Temperature | 0C to +85C (commercial, C7) | -40C to +85C (industrial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | — | 55,856 |
| User I/Os | — | 324 |
| Speed Grade | — | C9 (fastest commercial/industrial) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |