EP4CE55F23C7N vs EP4CE55F23C9L Vergleich
Detaillierter Direktvergleich von EP4CE55F23C7N von Intel und EP4CE55F23C9L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F23C7N | EP4CE55F23C9L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,40 | $76,73 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Maximum User I/O | 324 | — |
| Embedded 18x18 Multipliers | 66 | 156 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 472.5 MHz (C7 speed grade) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | — |
| Gehäuse | 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (F23) |
| Betriebstemperatur | 0C to +85C (commercial, C7) | -40C to +85C (industrial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 55,856 |
| User I/Os | — | 324 |
| Speed Grade | — | C9 (fastest commercial/industrial) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |