EP4CE6E22I7N vs EP4CE6E22I7 Comparison
Detailed side-by-side comparison of EP4CE6E22I7N by Intel and EP4CE6E22I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22I7N | EP4CE6E22I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 8 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm (low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Package | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| MSL Level | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LE) | — | 6,272 |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| PLLs | — | 2 |
| Maximum User I/O Pins | — | 91 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |