EP4CE6E22I7N vs EP4CE6E22I7 Comparação
Comparação detalhada lado a lado de EP4CE6E22I7N por Intel e EP4CE6E22I7 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4CE6E22I7N | EP4CE6E22I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $11,85 | $21,50 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 8 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm (low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Encapsulamento | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Nível MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 6,272 |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| PLLs | — | 2 |
| Maximum User I/O Pins | — | 91 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |