EP4CE6E22I7N vs EP4CE6E22I7 Comparaison
Comparaison détaillée côte à côte de EP4CE6E22I7N par Intel et EP4CE6E22I7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CE6E22I7N | EP4CE6E22I7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11,85 | $21,50 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 8 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm (low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Boîtier | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Niveau MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Statut RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 6,272 |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| PLLs | — | 2 |
| Maximum User I/O Pins | — | 91 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |