EP4CE6E22I7N vs EP4CE6E22I7 Comparación
Comparación detallada lado a lado de EP4CE6E22I7N por Intel y EP4CE6E22I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22I7N | EP4CE6E22I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,85 | $21,50 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | 8 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm (low-power) |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Encapsulado | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | 144-pin EQFP with exposed pad (22 x 22 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 6,272 |
| Embedded Memory | — | 270 Kbits (M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 15 |
| PLLs | — | 2 |
| Maximum User I/O Pins | — | 91 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40C to +100C |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| On-Chip Termination | — | Dynamic OCT supported |
| Configuration Methods | — | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |